Thermal interface materials market is likely to witness an impressive CAGR of 13.2% during the forecast period. The escalated claim from electronics sector, rising size-reduction of electronic contrivances, and incessant innovative product unveilings and developmental goings-on accepted by various companies are the prime drivers underpinning the growth of the global thermal interface materials market.
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Thermal Interface Materials Market Segment Insights:
By Type:
Based on the type, the market is segmented as greases & adhesives, tapes & films, gap fillers, metal-based thermal interface materials, phase change materials, and others. The phase change materials segment is estimated to be the fastest-growing segment in the coming five years. The growth is attributed to their specific properties, such as good conductor of electricity and capability to remain solid at room temperature and melt as the temperature increases.
By Application Type:
Based on the application type, the market is segmented as computers, telecom, medical devices, industrial machinery, consumer durables, automotive electronics, and others. The medical devices segment is estimated to be the fastest-growing segment during the forecast period. The electronic devices used in medical industry need proper thermal management. The electronics employed in this industry are required to remain cool sufficient to path uninterruptedly and appropriately within their functioning temperature arrays. The operative thermal management accords surplus heat to be resourcefully moved, uniformly spread, and adequately dissipated. This progresses system dependability and service lifespan of electronic contrivances in the medical sector. Several medical apparatuses influence the computing power of progressive microprocessors. These comprise ultrasound equipment, lasers, X-ray machines, and digital imaging know-hows. These devices require proper thermal administration as the surplus heat can upshot in imprecisions or breakdowns.
By Region:
In terms of regions, Asia-Pacific is expected to remain the largest market for thermal interface materials in the coming five years. China and India are the growth engines of the region. The market is driven by the growing demand from various end-use industries, such as telecom and consumer electronics in the region. Further, the demand for better consumer electronics and telecom devices is fueling the growth of the market. North America and Europe are also expected to offer considerable growth opportunities during the forecast period.
Key Players:
Some of the major players in the thermal interface materials market are The 3M Company, Henkel AG & Co. KGAA, Parker Hannifin Corporation, DOW Corning Corporation, Laird Technologies, Inc., Momentive Performance Materials Inc., The Bergquist Company, Inc., Indium Corporation, Wakefield-Vette, Inc., and Zalman Tech Co., Ltd.
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